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 Glob top

Glob top

Global top protects chips, solder joints and wires.

Global top makes it possible to package PCB chips and solder wires, making design changes more flexible. Global top sealants are used to protect chips and bonding leads, and are commonly used in PCB cob packaging process. For example, chip, gold wire protection, as well as the top sealing of the product installed to protect the barrier, isolate the physical and chemical damage caused by moisture, cold and hot shock, corrosion, bending, vibration and fatigue.

Process characteristics

Global top is mainly used in PCB cob packaging process, such as chip, gold wire protection, and top sealing of protection mounted products.


In the process of global top dispensing, glue quantity control, dispensing position and valve parameter planning are the key points to ensure the global top dispensing coverage integrity, dispensing thickness, no scattered spots and no bubbles.


The application of cob packaging technology, such as LED packaging, LCD screen module packaging, is more and more widely used, and the requirements are also improved. It is inevitable that the requirements for the control accuracy of glue quantity, consistency of dispensing system and wear resistance of dispensing system are higher and higher.


Axxon's contact dispensing system is the ideal choice to realize global top, and axxon has high-precision screw feeding system, mature and reliable products and solutions. In response to the future demand, axis automation has increased R & D investment, and has made great breakthroughs in the core technology fields such as rubber closed-loop control system and high wear-resistant screw feeding system.

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