No flow underfill is widely used in flip chip packaging.
In the process of no flow underfill dispensing, glue quantity control, dispensing path and valve parameter planning are the key points to ensure the coverage integrity, zero bubble and dispensing thickness of no flow underfill dispensing.
With the development of microelectronics industry to lightweight, thin, miniaturization, the increase of I / O terminals and the diversification of functions, it is inevitable that the requirements for the simplicity of the process flow, the accuracy of the dispensing system, and the stability of the dispensing system are becoming higher and higher.
Axxon's non-contact spray dispensing system and contact dispensing system can precisely control the amount of glue. In addition, axxon has rich experience in the research of no flow underfill process. Moreover, axxon has a mature and stable high-speed and high-precision motion platform, which can flexibly match the self-developed multi-type dispensing valve to meet the dispensing requirements of different products and glues.