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 No-flow underfill

No-flow underfill

No flow underfill adhesive acts as a flux in the early stage of chip packaging, and is converted into adhesive for bottom filling in reflow soldering

With the continuous development of consumer electronic products, the package size is gradually reduced, and bottom filling becomes a necessary process to improve the reliability of electronic products. No flow underfill can simplify the process flow without the capillary effect of glue. The bottom filling is well positioned before the solder ball patch. The reflow process completes solder ball welding and underfill curing at the same time, protecting semiconductor components and improving their service life.

Process characteristics

No flow underfill is widely used in flip chip packaging.


In the process of no flow underfill dispensing, glue quantity control, dispensing path and valve parameter planning are the key points to ensure the coverage integrity, zero bubble and dispensing thickness of no flow underfill dispensing.


With the development of microelectronics industry to lightweight, thin, miniaturization, the increase of I / O terminals and the diversification of functions, it is inevitable that the requirements for the simplicity of the process flow, the accuracy of the dispensing system, and the stability of the dispensing system are becoming higher and higher.


Axxon's non-contact spray dispensing system and contact dispensing system can precisely control the amount of glue. In addition, axxon has rich experience in the research of no flow underfill process. Moreover, axxon has a mature and stable high-speed and high-precision motion platform, which can flexibly match the self-developed multi-type dispensing valve to meet the dispensing requirements of different products and glues.

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