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 Dam & fill

Dam & fill

Dam & fill is used for packaging semiconductor chips and components, playing the role of strengthening, anti-seismic, dust-proof and waterproof.

With the continuous development of consumer electronic products, dam & fill has become a necessary process to improve the service life and product quality of electronic products. Dam & fill process belongs to double valve process, one valve body is dammed, the glue viscosity is high, and the other valve body is filled, the glue viscosity is low.

For semiconductor packaging, wire bonding packaging, smart card chip packaging, TP screen bonding and other processes, dam & fill can effectively package die or chip, so as to protect semiconductor components and improve their service life.

Process characteristics

Dam & fill is widely used in semiconductor packaging, wire bonding packaging, smart card chip packaging, TP screen bonding, etc.


In the process of Dam & fill dispensing, glue quantity control, dispensing path and dispensing speed planning are the key points to ensure dam height and the uniformity of fill glue coverage, no scattered points and zero bubbles.


With the rapid development of the electronic industry, there are higher requirements for the beauty, waterproof and anti falling of electronic products, especially for the final thickness of Dam & fill process dispensing, and the shape is "flat top". It is necessary to have higher and higher requirements on the accuracy of dispensing system, the stability of glue output and the width of overflow.


The combination of axxon's non-contact spray dispensing system and contact dispensing system is an ideal choice for Dam & fill, which can realize precise dispensing of dispensing area. Moreover, axxon has independent research and development of the core products of jet valve and piezoelectric valve, with mature and reliable products and solutions. In response to future demand, axis automation has increased R & D investment, and has made great breakthroughs in high precision, high precision control of glue width and high glue efficiency.

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