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 Chip level underfill

Chip level underfill

Protect the internal structure of the chip and prevent moisture and shock.

With the development of microelectronics industry to lightweight, thin, miniaturization, increasing the number of I / O terminals and functional diversification, flip chip packaging technology emerges as the times require, and underfill is the core process.

The underfill process is to fill the gap between the chip and the substrate with glue to protect and strengthen the solder ball or solder foot, which is commonly used in flip chip packaging.


Process characteristics

Chip level bottom filling usually adopts non-contact dispensing, which requires high requirements for scattered points and glue quantity.


The key points of bottom filling are as follows:

1. There are many components around, and the overflow width needs to be strictly controlled;

2. The surface of BGA chip is smooth, and it has high requirements for scattered spots, and there is no stain on the surface;

3. The tin balls in BGA are non-uniform and easy to travel the cavity during underfill;

4. Heating at the bottom of the machine will affect the viscosity of the glue, thus affecting the amount of glue.

For chip level underfill process, efficiency and consistency are particularly important.


Chip level underfill technology is applied in semiconductor industry, and the capacity and stability of equipment are very important for manufacturing enterprises. Axis automation has accumulated many years of application experience in semiconductor industry, and has mature and stable high-speed and high-precision motion platform It can be flexibly matched with various types of dispensing valves, and can be equipped with inclined rotating mechanism, three-stage transmission track and valve body cooling to meet the needs of different customers.

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