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 Chip grade solder paste

Chip grade solder paste

The solder paste mainly plays the role of conducting electricity, bonding and heat dissipation.

The most commonly used way of solder paste coating in semiconductor industry is stencil printing. With the decrease of pad area, a new method of solder paste coating, spot solder paste, has appeared.

Common solder paste methods are divided into contact and non-contact, which has obvious advantages for non-standard products and small batch development and testing in laboratory.

Process characteristics

Contact dispensing is the most common process for solder paste on the market

1. The uniformity of solder paste, screw valve to control the amount of glue more stable;

2. Precise control of dispensing height, high or low will affect the dispensing effect;

For the solder paste dispensing process, efficiency and consistency are particularly important.


Axis automatic control has accumulated many years of application experience in solder paste dispensing process, and has mature and reliable products and solutions. In response to future demand, axis automation has increased R & D investment, and has made great breakthroughs in the core technology fields of solder paste injection system, screw valve glue volume closed-loop control, dispensing height compensation control, etc.

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