In IC encapsulation process, the glue is required to cover the chip and solder joint completely, which can strengthen the chip and solder joint, prevent the chip and solder joint from falling off, and improve the product life and reliability.
The process of MEMS tin point requires a circle of solder paste around the base plate, and the glue path is required to be uniform without glue breaking. The process is mainly to weld the metal cover and the base plate together. The metal cover can improve the anti RF interference ability and improve the product sound quality.
For IC encapsulation, piezoelectric valve is recommended for high efficiency and precise glue control; screw valve is recommended for tin coating process. Axxon v-8000s screw valve is a kind of servo motor as the driving source, adopts the screw volume feeding principle, and the screw rotates in the cavity to realize the axial transmission function of medium. Through software integration, closed-loop control can be realized, valve opening time, feeding pressure and screw speed can be adjusted. Combined with reverse glue breaking technology, v-8000s can realize accurate and repeatable consistent dispensing to meet different process requirements.