Packaging technology is mainly used in consumer electronics industry (including mobile phone, pad, notebook, etc.) and related PCB, FPC board assembly.
Components with overall encapsulation process shall be completely wrapped with glue, and there shall be no leakage position; for components with pin / welding pin encapsulation process, pins / welding pins shall be wrapped with glue; special positions shall not be stained with glue, and the overflow width shall be controlled within a certain range.
With the high integration of electronic components, precise glue quantity control and overflow width control have become the development trend of the industry.
Axis automation has accumulated many years of application experience in the application of encapsulation process, and has mature and reliable products and solutions. In response to future demand, axis automation has increased R & D investment, and has made great breakthroughs in the core technology fields such as glue closed-loop control system and avi detection system.