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 Package of components / Pins  Package of components / Pins

Package of components / Pins

The components are firmly pasted on the PCB surface to prevent them from shifting and falling.

Due to the high integration of PCB, there are more and more components on PCB, and they are becoming smaller and smaller. In the process of solder paste printing, the solder paste on some small components is too small, which causes the bonding strength to be too small, and the components are easy to fall off, so it is necessary to use red glue to reinforce them.

In addition, some special-shaped components or IC and large component devices with pin package need to be reinforced with red glue in order to prevent displacement or skew when passing through the furnace.

Process characteristics

Packaging technology is mainly used in consumer electronics industry (including mobile phone, pad, notebook, etc.) and related PCB, FPC board assembly.


Components with overall encapsulation process shall be completely wrapped with glue, and there shall be no leakage position; for components with pin / welding pin encapsulation process, pins / welding pins shall be wrapped with glue; special positions shall not be stained with glue, and the overflow width shall be controlled within a certain range.


With the high integration of electronic components, precise glue quantity control and overflow width control have become the development trend of the industry.


Axis automation has accumulated many years of application experience in the application of encapsulation process, and has mature and reliable products and solutions. In response to future demand, axis automation has increased R & D investment, and has made great breakthroughs in the core technology fields such as glue closed-loop control system and avi detection system.

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