Underfill is widely used in consumer electronics industry, such as mobile phone, pad, notebook, and related PCB, FPC board. Bottom filling mainly refers to dispensing BGA, CSP, pop and other components.
In the underfill dispensing process, the glue quantity control, dispensing path, waiting time and dispensing angle planning are the key points to ensure that the bottom filling and diffusion are uniform, no scattered points, no bubbles and extremely narrow overflow width.
The chip or solder joint damage is easily caused by the drop or vibration of electronic products. In addition, consumer electronics manufacturers have higher and higher requirements for many characteristics, such as dust-proof, moisture-proof, anti-seismic, high-low-temperature resistance and so on. Therefore, it is necessary to have higher and higher requirements on the glue quantity stability, dispensing positioning accuracy and overflow width of the dispensing system.
Axxon's non-contact spray dispensing system is the ideal choice for bottom filling, which can realize precise dispensing of dispensing area and control dispensing amount through patented calibration process spray technology (CPJ). Moreover, axxon has self-developed core products of jet valve and piezoelectric valve, which can realize dispensing of various fluids and adhesives with high speed and controllable capacity. In addition, axxon has the optional functions of inclined dispensing technology, double valve dispensing technology, hanging glue detection, AVI dispensing effect detection, etc., which can more flexibly handle different product process requirements.