Corner bonding is mainly used for motherboards of various consumer electronic products, home appliance industry control motherboards, power control boards, automotive central control circuit boards, plug-in type double-sided boards, and various motherboards with large BGA or CSP types.
In the dispensing process of corner bonding, the key points of dispensing process are glue quantity control, glue length, glue width and glue height.
In corner bonding process, there are strict requirements for the aspect ratio of dispensing, which not only needs to ensure the width, but also ensures the height of glue. In order to meet the requirements of various aspect ratios, the glue manufacturers constantly reduce the fluidity of glue, which leads to the increasing viscosity of glue. The increase of glue viscosity will have a high requirement on the valve body gluing and maintenance frequency.
Axis automation has accumulated many years of application experience in corner bonding process, and has mature and reliable products and solutions. In response to the future demand, axis automation has increased R & D investment, and has made great breakthroughs in the core technology fields such as rubber closed-loop control system, AVI detection system, and high wear-resistant screw feeding system.