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 Chip heat dissipation  Chip heat dissipation

Chip heat dissipation

The heat generated by the chip operation needs to be conducted to the heat sink by the thermal conductive material

The high integration of chips leads to the increase of unit power consumption and the requirement of heat dissipation per unit area.

Because of the gap between the heat sink and the chip, the heat dissipation effect is not good. Therefore, it is necessary to fill the gap with thermal conductive materials to make the heat transfer from the chip to the heat sink in time to ensure the heat dissipation effect of the chip.

Process characteristics

The chip is widely used in all walks of life, among which the industries with higher heat dissipation requirements are: security intelligence, led, communication equipment, automotive electronics, semiconductor, power tools, optical module, consumer electronics, power module, etc.


In the process of chip heat dissipation dispensing, glue quantity control, glue quantity precision, dispensing speed and dispensing path planning are the key points to ensure zero bubble, complete coverage area and consistent glue thickness after lamination.

The high integration of chips leads to the increase of unit power consumption, which requires better heat dissipation effect. Therefore, the manufacturers of thermal conductive materials constantly increase metal fillers to improve the thermal conductivity of materials, which inevitably puts forward higher requirements for the wear resistance, glue delivery speed and glue volume stability of dispensing system.


Axis automation has accumulated many years of application experience in chip heat conduction process, and has mature and reliable products and solutions. In response to the future demand, axis automation has increased R & D investment, and has made great breakthroughs in the core technology fields such as rubber closed-loop control system, AVI detection system, and high wear-resistant screw feeding system.

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