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 Solder paste  Solder paste

Solder paste

Mainly used for SMT industry PCB surface resistance, capacitance, IC and other electronic components welding.

Solder paste is a new type of welding material with SMT. It is a paste mixture formed by mixing solder powder, flux and other surfactants and thixotropic agents.

At present, the most commonly used way of solder paste coating in SMT industry is stencil printing. With the decrease of pad area, a new way of solder paste coating, spot solder paste, appeared.


Process characteristics

Solder paste dispensing method: Needle contact type Jet type Screw type


Needle contact type : time and pressure dispensing, contact dispensing.


Jet type At present, the solder paste injection valve of mycronic can realize the point diameter of about 0.5mm.


Screw type The screw valve realizes solder paste point by screw rotation and feeding pressure. Screw shear and feeding pressure control the actual amount of solder paste. Axxon's v-8000 series screw valve has a limit point diameter of about 0.15mm and a limit line diameter of about 0.2mm.


Both needle cylinder solder paste and screw valve solder paste are contact dispensing, and dispensing height is one of the important factors affecting dispensing effect. Axxon dispensing platform is equipped with laser height detection module and needle automatic correction module to detect and compensate dispensing height in real time, which can ensure the consistency of point diameter and wire diameter.


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