SMT & PCB assembly
With the popularity of electronic products, people's laziness to electronic products has become higher and higher, and the frequency of updating is also relatively fast. It not only puts forward higher requirements for the appearance of products, but also puts forward higher requirements for the quality of products.
Nowadays, no matter whether it is hard board or soft board, whether it is resistance or capacitance to IC, all of them are engaged in encapsulation, bottom filling, bonding and reinforcement, which are all to ensure the reliability of products. Especially for mobile phones, the level of dust-proof and water discharge is getting higher and higher. For some glue dispensing points, we really strive for improvement. We not only use 3D laser for graphic guidance, but also use them for rectification To ensure that every product can achieve 100% yield by the trace of dispensing contour and the detection of glue type.
Axxon keeps up with the progress and change of the times, designs more appropriate and more suitable products according to the requirements of customers. It has also been recognized by the market and trusted by customers, providing better services for customers and creating more value.